FEI Joins Metrology Research at University of Albany

Juli 15, 2009

FEI Company, a provider of atomic-scale imaging and analysis systems, and Sematech, the global consortium of chipmakers, announced that FEI has joined Sematech’s Advanced Metrology Development Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, US. As a member of this program, FEI will collaborate with experts to develop high-resolution capabilities of transmission electron microscopy (TEM) analysis, with electron energy loss spectroscopy (EELS) and focused ion beam (FIB) technology to address critical needs in process development and defect analysis.
www.fei.com
www.cnse.albany.edu
www.sematech.org

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Microscopy and Microanalysis Conference

Mai 18, 2009

The Microscopy & Microanalysis 2009 Conference, which is the annual meeting of the Microscopy Society of America and the Microbeam Analysis Society, will take place from July 26-30, 2009 in Richmond, Virginia, US. This year’s conference is co-sponsored by the International Metallographic Society. The event addresses to scientists, technologists and students who use microscopy or microanalysis in their research. Topics of the full-day short courses include electron tomography, digital imaging, FIB methodologies, variable pressure and environmental SEM imaging and analysis, cryo EM and interpretation of metallographic microstructures. Over 30 symposia focus on applications in both the biological and physical sciences as well as recent and emerging trends in instrumentation and techniques. Further, contributed sessions, tutorial sessions, poster presentations as well as round-table discussions will be held. www.internationalmetallographicsociety.org
http://mm2009.microscopy.org